UW NNCI Site - WNF Lab Tool List
Device and Structure Characterization
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Description
This is a contact profilometer capable of measuring step heights that range from tens of nanometers to one millimeter. It can also measure surface roughness and film stress. It can accommodate 100mm, 125 mm, and 150 mm wafers as well as smaller chips. It is capable of automated measurements with step detection. The stylus has a radius of 2 um and a cone angle of 60 degrees.
Details
(none given)
Materials Restrictions
(none)
Bruker Dimension FastScan AFM | 
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|---|---|---|
| Coral ID: | WNF--AFM--Bruker-Dimension-FastScan | |
| Manufacturer: | Bruker | |
| Model: | Dimension FastScan | |
| Lab: | WNF | |
| Area: | Device and Structure Characterization | |
| Manual: | Bruker FastScan Atomic Force Microscope SOP.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
This is an atomic force microscope is capable of high resolution imaging of small step heights and material surfaces. The tool can also measure magnetic or atomic forces. The tool can accommodate samples up to a 200mm wafer.
Details
Vertical scan height of 4.47um
Nanometer scale resolution
Materials Restrictions
Samples must be clean and dry. Features should be less than 4.4um tall
Filmetrics F50 Thin Film Reflectometer | 
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|---|---|---|
| Coral ID: | WNF--Reflectometer--Filmetrics-F50 | |
| Manufacturer: | Filmetrics | |
| Model: | F50 | |
| Lab: | WNF | |
| Area: | Device and Structure Characterization | |
| Manual: | FilmetricsUserInstructions_V1.0.pdf | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
Optical measurement of thin film layers on various substrates. Uses spectral reflectance to determine film thickness, refractive index, and extinction coefficient by scanning wavelengths from 200 to 1700 nm. Substrates up to 150 mm can be mapped automatically.
Details
(none given)
Materials Restrictions
(none)
Keyence Laser Scanning Confocal Microscope | 
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|---|---|---|
| Coral ID: | WNF--Confocal-Microscope--Keyence-VK-X150K | |
| Manufacturer: | Keyence | |
| Model: | VK-X150K | |
| Lab: | WNF | |
| Area: | Device and Structure Characterization | |
| Manual: | Keyence_SOP1_1.pdf | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
This laser scanning confocal microscope obtains 3D measurements from a wafer surface for measurement of both step heights and lateral dimensions. This model uses a red (658 nm) laser. The step height measurement has a resolution of 5 nm with a minimum step height of 50 nm. Lateral measurements have a resolution of 250 nm.
Details
(none given)
Materials Restrictions
(none)
Zygo ZeGage Pro HR | 
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|---|---|---|
| Coral ID: | WNF--Profilometer--Zygo-ZeGage-Pro-HR | |
| Manufacturer: | Zygo | |
| Model: | ZeGage Pro HR | |
| Lab: | WNF | |
| Area: | Device and Structure Characterization | |
| Manual: | SOP Draft Zygo.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
The ZeGage Pro HR is a high resolution 3D optical profilometer using white light interferometry to achieve sub-nanometer resolution.
Details
Specifications:
Vertical scan range: 20 mm
Surface topography repeatability: ≤ 0.15 nm
Repeatability of RMS: 0.01 nm
Step height accuracy: ≤ 3%
Features include:
- Objectives:
- Measurement array up to 1600x1200
- Motorized stage and automation with 100 mm travel
Materials Restrictions
Samples must be clean and dry. No residue should be left behind on the stage.
Dry Etch
Barrel Asher | 
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|---|---|---|
| Coral ID: | WNF--Asher--BarrelEtch | |
| Manufacturer: | Glow Research | |
| Model: | AutoGlow | |
| Lab: | WNF | |
| Area: | Dry Etch | |
| Manual: | SOP_Barrel_Asher_v2d.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Barrel asher used to strip resist or other organic films, descum patterned resist, or clean surfaces of residual organics using an isotropic oxygen plasma.
Details
Accomodates substrate from chips up to 100mm diameter wafers.
Materials Restrictions
Allowed etch target materials: Photoresist, e-beam resist, organic contaminants, other polymers (No SU8.) No high-vapor-pressure materials. Please contact tool owner to discuss materials not included on this list.
ICP01 Special Materials | 
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|---|---|---|
| Coral ID: | WNF--DRIE1--Oxford | |
| Manufacturer: | Oxford Instruments | |
| Model: | ICP 380 | |
| Lab: | WNF | |
| Area: | Dry Etch | |
| Manual: | ICP1-SpecialMaterial-Oxford_SOPv7_07232024.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
ICP Etch system for etching Lithium Niobate, 2-D materials (WSe2, BN, MoS2...) and other special materials.
Details
100mm wafers - chips must use a 100mm carrier wafer with die attach via Fomblin or Stantovac vacuum oils. Available process gases: SF6 (0-100sccm), O2 (0-100sccm), C4F8 (0-100sccm), Ar (0-100sccm), H2 (0-50sccm), and CH4 (0-100sccm). NOTE: Tool configuration alternates between Lithium-containing-compound-etching, Magnesium-containing-compound-etching, and Non-Lithium/Magnesium-containing-compound-etching. Each configuration has a dedicated quartz clamp ring with extensive manual and plasma chamber cleaning occurring during the re-configuration. Generally, the configuration schedule alternates on a weekly basis; however, this regime may deviate from this depending on user requirements. Please see tool owner for details. Current configuration can be found in Coral comments for this tool (search both 'unresolved' and 'resolved' comments).
Materials Restrictions
100mm wafers or dies/chips attached to 100mm carrier wafer. Allowed etch target materials: Silicon, Silicon Oxide, Silicon Nitride, Lithium Niobate, 2D materials, PMDS, Polyimide, Parylene, Graphene, Niobium, some refractory metals. Allowed mask materials: Photoresist, E-Beam Resist, SiO2, Silicon Nitride, Alumina, some metal masks. Please see tool owner to discuss and gain permission for other hard mask materials, including metal masks. No exposed Copper, Gold, nor Silver. No high-vapor-pressure materials. Please contact the tool owner to discuss materials not included on this list.
ICP02-Fluorine | 
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|---|---|---|
| Coral ID: | WNF--ICP--Oxford-Fluorine | |
| Manufacturer: | Oxford | |
| Model: | PlasmaLab 100, ICP-180 | |
| Lab: | WNF | |
| Area: | Dry Etch | |
| Manual: | ICP2-F-Oxford_UserSOP_v8B_20240717.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
Plasma tool capable of highly anisotropic etching using fluorine-based etch chemistries. Additionally, isotropic etching is available via ICP-only configuration. Load-locked for rapid load/unload and good process consistency. Wafer stage is temperature controlled via chilled nitrogen gas - upon request, additional LN2-cooling is available for cryo-etching. NOTE: New chamber cleaning policy: all chamber cleaning must be done with the system enabled and, at intervals of no more than 15 minutes, users must confirm the clean process continues to run to completion without error. The tool may be disabled only if there is less than 15 minutes left on the clean.
Details
Process gases: C4F8, CHF3, N2, O2, Ar, and SF6. 100mm wafers only. Smaller sizes can be accomodated using a 100mm silicon wafer as a carrier wafer.
Materials Restrictions
Allowed etch target materials: Silicon, Silicon Dioxide (see below), Silicon Nitride, some refractory metals including Tungsten and Molybdenum, SiC, Polyimide, Parylene, Graphene. Allowed mask materials: Photoresist, E-Beam Resist, SiO2, Silicon Nitride, Alumina. (Metal masks are not allowed.) No dirty glass can be etched (<99% SiO2), ie no pyrex, no borosilicate, no soda-lime. No exposed metal including copper, gold, and silver. Note: SiO2 (quartz and fused silica) are limited to 4um total etch depth. No high-vapor-pressure materials. Please contact tool owner to discuss materials not included on this list.
ICP03-Chlorine | 
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|---|---|---|
| Coral ID: | WNF--ICP--Oxford-Chlorine | |
| Manufacturer: | Oxford | |
| Model: | PlasmaLab 100, ICP-180 | |
| Lab: | WNF | |
| Area: | Dry Etch | |
| Manual: | ICP3-Cl-Oxford_UserManual_v6B.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
Highly anisotropic Inductively Coupled Plasma (ICP) etching using chlorine-based etch chemistries for etching Silicon, III-V semiconductors, aluminum and chrome. Load-locked for rapid load/unload and high process consistency. See tool owner for specific material restrictions.
Details
Process gases: BCl3, Cl2, H2, N2, O2, CH4, SF6, and Ar. A heated stage allows etching at substrates temperatures up to 250 C. 100mm wafers only. Smaller sizes can be accomodated using a 100mm silicon wafer as a carrier wafer (Users must supply their own carrier wafer - do not use the system dummy wafer as a carrier). Please take note of new policy changes outlined under 'Restrictions' in the ICP-C's SOP concerning resist edge-bead removal and oxygen process gas.
Materials Restrictions
Allowed etch target materials: Silicon, Silicon Dioxide (see below), Silicon Nitride, GaAs, GaP, GaN, AlN, InP, Al, Cr, Ti. Contact tool owner for other III-V and II-VI materials. Allowed mask materials: Photoresist, E-Beam Resist, SiO2, Silicon Nitride, Alumina. Metal masks not allowed. No exposed noble metals including copper. Do not etch quartz nor fused silica. Note: Certain III-V compounds require elevated chuck temperatures - see tool owner. No high-vapor-pressure materials. Please contact tool owner to discuss materials not included on this list.
Reactive Ion Etcher 1 | 
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|---|---|---|
| Coral ID: | WNF--RIE1--Vision | |
| Manufacturer: | Vision | |
| Model: | Vision 320 RIE Mark II | |
| Lab: | WNF | |
| Area: | Dry Etch | |
| Manual: | RIE1-Cortex_UserManual_v6.1.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
A parallel-plate Reactive Ion Etch (RIE) system. Open load for flexible substrate handling. Etch gases are: Ar, CF4, CHF3, O2, and SF6.
Details
Open load with ~12-inch platen allowing multiple substrates and substrate sizes.
Materials Restrictions
Allowed Etch target materials: silicon, silicon nitride, silicon oxide, PMDS, Polyimide, Parylene, Graphene, photoresist. Allowed mask materials: photoresist, ebeam-resist, silicon oxide, silicon nitride, alumina. No metal masks are allowed. No Exposed metal (including copper, gold, and silver) nor dirty glasses (<99% SiO2). Please contact the tool owner to discuss materials not included on this list. No high-vapor-pressure materials.
Reactive Ion Etcher 2 | 
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|---|---|---|
| Coral ID: | WNF--RIE2--Vision | |
| Manufacturer: | Advanced Vacuum | |
| Model: | Vision 320 MkII | |
| Lab: | WNF | |
| Area: | Dry Etch | |
| Manual: | RIE2-Cortex_UserManual_v4.1.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
A parallel-plate Reactive Ion Etch (RIE) system. Open load for flexible substrate handling. Etch gases are: Ar, CF4, CHF3, N2, O2, and SF6. This the designated clean RIE tool - Allowed materials are strictly enforced.
Details
Open load system with 12-inch platen allowing multiple substrates and substrate sizes.
Materials Restrictions
Allowed Etch target materials: silicon, silicon nitride, silicon oxide, PMDS, Polyimide, Parylene, Graphene, photoresist. Allowed mask materials: photoresist, ebeam-resist, silicon oxide, silicon nitride, alumina. No metal masks are allowed. No Exposed metal (including copper, gold, and silver) nor dirty glasses (<99% SiO2). Please contact the tool owner to discuss materials not included on this list. No high-vapor-pressure materials.
SPTS Silicon DRIE | 
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|---|---|---|
| Coral ID: | WNF--DRIE2--SPTS | |
| Manufacturer: | SPTS | |
| Model: | Rapier Si_DRIE | |
| Lab: | WNF | |
| Area: | Dry Etch | |
| Manual: | SPTS-DRIE SOP v8_11_15_2024.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
The SPTS Rapier is a highly functional inductively coupled ion etch tool that uses a time-multiplexed SF6-C4F8 process, also known as the Bosch Process. The parameter space for this tool is extensive and getting lost therein easily done. Several pseudo-standard recipes are available as starting points, but most processing on this tool will require some development. We're here to help.
Details
(none given)
Materials Restrictions
Etch target material is limited to silicon with mask material restricted to silicon oxide, silicon nitride, photoresist and e-beam resist. Wafer size is limited to 100mm only. It is not permitted to etch through wafer without a carrier or handle wafer between the etch target and the chuck. Note: No exposed metals (including copper, gold, and silver). Contact tool owner regarding restriction details.
SPTS uEtch Module HF Vapor etcher | 
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|---|---|---|
| Coral ID: | WNF--Vapor-Etch--HF | |
| Manufacturer: | SPTS | |
| Model: | MicroEtch | |
| Lab: | WNF | |
| Area: | Dry Etch | |
| Manual: | HFVapor-Etch_v1.3b.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
This HF Vapor Dry Etch system is configured with Hydrofluoric and Ethanol vapor used, primarily, for isotropic etching of silicon dioxide without a plasma. The HFVapor system etches at reduced pressure and 45C to isotropically etch sacrificial silicon oxide layers, primarily to release silicon microstructures in MEMS devices. The dry process avoids stiction of released moving parts and damage to delicate structures – common issues with conventional wet processing technology. This is a single wafer system for 4 inch to 8 inch wafers and dies on a carrier wafer.
Details
Etch target is primarily silicon dioxide. Recommended mask materials are silicon, Al, Au, Cr, Ni, SiC, Al2O3, LPCVD nitride. PECVD nitride is NOT recommended as a masking material.
Materials Restrictions
POLYMERS INCLUDING PHOTO/EBEAM RESIST ARE NOT ALLOWED IN THIS SYSTEM. No polymers (including photo nor ebeam resists), no Kapton tape is allowed in the tool. Additional materials NOT ALLOWED: doped oxide, doped glass, borosilicate glass, soda-lime glass, float-glass, pyrex, Ti, TiO2, and copper. Do not use materials other than those known as approved. If a material that is not listed here, please contact the tool owner.
Xenon Difluoride vapor etcher | 
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|---|---|---|
| Coral ID: | WNF--Vapor-Etch--XeF2 | |
| Manufacturer: | SPTS | |
| Model: | e2 | |
| Lab: | WNF | |
| Area: | Dry Etch | |
| Manual: | XeF2Vapor-Etch_v1.2c.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
The XeF2 vapor etch tool is for primarily for isotropic chemical etching of silicon sacrificial layers for the release of MEMS structures.
Details
Xenon difluoride (XeF2) provides a highly selective isotropic etch for Si, Mo and Ge and is an ideal solution for etching sacrificial layers to “release” moving components within MEMS devices. It provides numerous unique advantages and capabilities compared to wet and SF6 plasma etch options. The process is generally carried out at pressures between 0.5 and 4 torr providing controlled, stiction-free and residue-free etching. Typical vertical and lateral silicon etch rates are in the 0.1 - 10 microns/minute range. Because of its selectivity and excellent reach, XeF2 can be used to make very long undercuts with little or no degradation of etch stop, mask or device layers. Silicon dioxide masks, with a Si:oxide selectivity of >1,000:1, have been used to achieve very long undercuts (well over 100μm) and to protect extremely small or thin devices (less than 30nm). XeF2 does not attack polymers or other organic films. Photoresist can be used as a cost-effective mask and polymeric passivation layers, such as those from the Bosch Process, can be used as an effective protective layer for trench sidewalls. XeF2 is also an ideal way to release PDMS, parylene, and SU8. Since XeF2 does not etch packing and dicing materials, it can increase yield by delaying the release of a MEMS device until after dicing or package insertion and wire bonding. XeF2 has been used successfully to release MEMS devices on diced wafers and chips inside packages.
Materials Restrictions
Allowed etch target materials: silicon, germanium, molybdenum, SiGe, Ti, W. Allowed masks(typical selectivity): photo/ebeam resists, PDMS, silicon dioxide(1000:1), silicon nitride(100:1), Au, Al, Ni, Cr, Pt, SiC. DO NOT use this tool for thinning silicon wafers or to thin silicon chips. See tool owner for further information.
Inspection
Goniometer | 
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|---|---|---|
| Coral ID: | WNF--Goniometer--OCA-20 | |
| Manufacturer: | OCA | |
| Model: | 20 | |
| Lab: | WNF | |
| Area: | Inspection | |
| Manual: | OCA Goniometer User Instructions Quick Guide.pdf | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
Is is a goniometer used to characterize solid-liquid interactions by optically measuring contact angles. It can accommodate samples from chips up to 200,, wafers.
Details
This tool uses backlighting and optics to measure contact angles between liquids and solid surfaces. Currently this tool is set up for DI water only
Materials Restrictions
Samples must be clean, dry, and leave no residue on the stage
Leica DVM2500 digital microscope | 
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|---|---|---|
| Coral ID: | WNF--Microscope--Leica-Backend | |
| Manufacturer: | Leica | |
| Model: | DVM2500 | |
| Lab: | WNF | |
| Area: | Inspection | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
This digital microscope is capable of variable angles, has a long working distance, and has magnification from 20x to 160x,
Details
(none given)
Materials Restrictions
(none)
Leica Microscope | 
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|---|---|---|
| Coral ID: | WNF--Microscope--Leica | |
| Manufacturer: | Leica / Reichert | |
| Model: | Polylite 88 | |
| Lab: | WNF | |
| Area: | Inspection | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
Priority inspection in support of wet chemistry and develop activities. NO WET MATERIALS ARE ALLOWED ON THE MICROSCOPE STAGE.
Microscope is not interlocked for ease of use. Users are expected to be logged into Wet Chem Bay A to use this asset.
Camera computer is interlocked in CORAL. Users undertaking dedicated inspection activities longer than 5-10 minutes should be logged into CORAL (not Bay A)
The microscope is capable of Nomarski imaging/DIC and has a stage that can accommodate wafers up to 150 mm.
Details
(none given)
Materials Restrictions
No Wet Materials allowed on Microscope Stage
Nikon 6" Microscope | ||
|---|---|---|
| Coral ID: | WNF--Microscope08--Nikon | |
| Manufacturer: | Nikon | |
| Model: | LV150N | |
| Lab: | WNF | |
| Area: | Inspection | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
This is one of the primary imaging optical microscopes at the WNF. It includes five objectives (5X - 100X), an LED light source, a UV cutoff filter, and imaging in both bright field and dark field. It is capable of imaging clean samples as small as chips and as large as 150 mm wafers.
Details
(none given)
Materials Restrictions
(none)
Nikon 8" Imaging Microscope | 
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|---|---|---|
| Coral ID: | WNF--Microscope09--Nikon | |
| Manufacturer: | Nikon | |
| Model: | Eclipse L200ND | |
| Lab: | WNF | |
| Area: | Inspection | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
This is the primary optical microscope for imaging of wafers at the WNF. It includes six objectives (2.5X - 100X), an LED light source, a UV cutoff filter, bright field and dark field imaging, and differential interference contrast. It is capable of imaging clean samples as small as chips and as large as 200 mm wafers.
Details
(none given)
Materials Restrictions
Clean and dry samples only. Resists must be properly baked. Nothing should be left behind on the stage after inspection.
Nikon Semiconductor Optical Microscope | 
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|---|---|---|
| Coral ID: | WNF--Microscope--Nikon | |
| Manufacturer: | Optiphot | |
| Model: | 200 | |
| Lab: | WNF | |
| Area: | Inspection | |
| Manual: | 201309 Nikon Microscope.pdf | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
This optical microscope including dark-field imaging, LED light sources for both reflected and transmitted illumination, and a camera for image capture. The stage can accommodate wafers up to 200 mm in diameter as well as irregular samples.
Details
(none given)
Materials Restrictions
(none)
Wafer Inspection Tool | 
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|---|---|---|
| Coral ID: | WNF--Wafer-Analyzer--Nanotronics-Nspec | |
| Manufacturer: | Nanotronics | |
| Model: | nSpec LS | |
| Lab: | WNF | |
| Area: | Inspection | |
| Manual: | Nanotronics SOP 20241027.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Used for automated inspection of devices, repeating patterns, and full wafer defect mapping.
Details
Objectives: 2.5x, 5x, 10x, 20x, 50x
Illumination modes: bright field, dark field, differential interference contrast
Software rev 0.23.0.2 (as of 3-31-25)
Materials Restrictions
(none)
Lithography and Direct Patterning
ABM Contact Aligner | 
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|---|---|---|
| Coral ID: | WNF--Aligner--ABM | |
| Manufacturer: | AB-M | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | ABM SOP (Teaching Lab).pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Contact photolithography exposure tool for 100mm wafers. An optimized process can achieve 2 um line/space patterns with a layer-to-layer registration accuracy about 3 um.
Details
(none given)
Materials Restrictions
Uses 5in or 7in square photomasks with 0.090in thickness. Configured for exposure of 100mm wafers; smaller chips can be accomodated using a carrier wafer.
CEE Apogee Spin Coater | 
| |
|---|---|---|
| Coral ID: | WNF--SPIN5 | |
| Manufacturer: | WAFAB | |
| Model: | 48" SST Front Acess Wet Bench | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | SPIN4_5_Apogee_SOP_V1.2.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Flexible, manual bench-top spin coater with vacuum chucks available for pieces from a few mm up to 150 mm wafers.
Details
(none given)
Materials Restrictions
(none)
DWL66+ Direct Write | 
| |
|---|---|---|
| Coral ID: | WNF--MaskWriter--Heidelberg-DWL66plus | |
| Manufacturer: | Heidelberg | |
| Model: | DWL66+ | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | DWL66+ Basic SOP_March2024.pdf | |
| UW Academic Rate: | $33/hr | |
| Industrial Rate: | $99/hr | |
| Outside Academic Rate: | $33/hr | |
Description
Create masks or direct write on substrates with alignment capability utilizing a 405nm laser. Write modes HiRes with 300nm minimum feature, 4mm head with 0.8um minimum feature, and 20mm head with 2um minimum feature.
Details
(none given)
Materials Restrictions
(none)
EBL01--JEOL-6300FS | 
| |
|---|---|---|
| Coral ID: | WNF--EBL--JEOL-JBX6300FS | |
| Manufacturer: | JEOL | |
| Model: | JBX6300FS | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| UW Academic Rate: | $137/hr | |
| Industrial Rate: | $495/hr | |
| Outside Academic Rate: | $137/hr | |
Description
Direct-write 100 kV Electron Beam Lithography capable of feature sizes as small as 10 nm, and layer-to-layer registration better than ~30 nm m+3s.
Details
Substrates from small chips to 150mm wafers. A wide range of beam currents, choice of two objective lenses, and a wide range of resist processes provide significant flexibility for a variety of needs. Sophisticated data preparation software provides advanced functions including full shape and dose proximity correction.
Materials Restrictions
All materials must be explicitly approved by staff.
EVG Aligner | 
| |
|---|---|---|
| Coral ID: | WNF--Aligner--EVG | |
| Manufacturer: | EVG | |
| Model: | 620 | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | EVG Aligner June2024.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Contact photolithography tool for exposure of 100mm wafers. An optimized process can achieve 2 um line/space patterns with a layer-to-layer registration accuracy about 3 um. Backside alignment is possible using a second set of alignment optics.
Details
Uses 5in square photomasks with 0.090in thickness. Configured for exposure of 100mm wafers; smaller chips can be accomodated using a carrier wafer.
Materials Restrictions
(none)
HMDS/Image Reversal Oven | 
| |
|---|---|---|
| Coral ID: | WNF--YES-Oven | |
| Manufacturer: | Yield Engineering Systems | |
| Model: | YES-58 | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | YES58-Oven_SOP_20241125.pdf | |
| UW Academic Rate: | $33/hr | |
| Industrial Rate: | $99/hr | |
| Outside Academic Rate: | $33/hr | |
Description
HMDS oven for priming wafers. Has image reversal capability, but ammonia is currently not hooked up to the system.
Details
(none given)
Materials Restrictions
(none)
Nanoscribe Photonic Professional GT | 
| |
|---|---|---|
| Coral ID: | WNF--Nanoscribe-Photonic-Professional-GT | |
| Manufacturer: | Nanoscribe | |
| Model: | Photonic Professional (GT) | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | Nanoscribe SOP 2.0.pdf | |
| UW Academic Rate: | $33/hr | |
| Industrial Rate: | $99/hr | |
| Outside Academic Rate: | $33/hr | |
Description
3D printing platform for micro- and nanofabrication demands utilizing two-photon polymerization. Structures can either be designed in 3D printer compatible CAD software programs or directly implemented in Nanoscribe’s GWL scripting language.
Details
(none given)
Materials Restrictions
(none)
Rite Track Automated Coater | 
| |
|---|---|---|
| Coral ID: | WNF--Coater--Rite-Track-SVG90S | |
| Manufacturer: | Rite Track | |
| Model: | SVG-90S | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | RiteTrack_SOP_2024.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
Automated coater cluster tool with 100mm, 150mm and 200mm capability. Auto dispenses AZ1512, AZ10XT, AZ701 and NR-9 3000 photoresists. Recipes often utilize frontside and backside EBR. Modules include: HMDS vapor prime, coater, cold plate and two vacuum bake ovens.
Details
(none given)
Materials Restrictions
(none)
Rite Track Automated Developer | 
| |
|---|---|---|
| Coral ID: | WNF--Developer--Rite-Track-SVG90S | |
| Manufacturer: | Rite Track | |
| Model: | SVG-90S | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | RiteTrack_SOP_2024.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
Automated developer cluster tool with 100mm, 150mm and 200mm capability. Auto dispenses AD10MIF and AZ400K developers. Recipes utilize frontside and backside DI water rinse. Modules include: vacuum bake, cold plate, developer.
Details
(none given)
Materials Restrictions
(none)
Semi-Auto AB-M | 
| |
|---|---|---|
| Coral ID: | WNF--ABM-SemiAuto-Aligner | |
| Manufacturer: | ABM | |
| Model: | Semi-Auto | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | ABM-SemiAuto_SOP_Sept2024.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Semi-auto contact photolithography exposure tool for 100mm wafers. Capable of front to back alignment utilizing IR.
Details
(none given)
Materials Restrictions
(none)
Solvent Bench | 
| |
|---|---|---|
| Coral ID: | WNF--BATH6-Strip | |
| Manufacturer: | WAFAB | |
| Model: | 72" SST Front Acess | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | BATH6-Strip_2.0.pdf | |
Description
Solvent bench with an EKC photoresist stripping bath and a sonicator for liftoff processing.
Details
Refilled weekly
Materials Restrictions
(none)
Spin Coater | 
| |
|---|---|---|
| Coral ID: | WNF--SPIN4-General | |
| Manufacturer: | CEE | |
| Model: | APOGEE SPIN | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | SPIN4_5_Apogee_SOP_V1.2.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Flexible, manual bench-top spin coater with vacuum chucks available for pieces from a few mm up to 200 mm wafers.
Details
(none given)
Materials Restrictions
(none)
Spin Coater | 
| |
|---|---|---|
| Coral ID: | WNF--SPIN3-EBeam | |
| Manufacturer: | Cost Effective Equipment | |
| Model: | APOGEE SPIN | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | SPIN3_Apogee_SOP_V1.3.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Manual, benchtop spin coater with vacuum chucking for samples from a few mm to 200mm wafers.
Details
(none given)
Materials Restrictions
Limited to use for Electron Beam Resists only!
Suss Spin Coater | 
| |
|---|---|---|
| Coral ID: | WNF--SPIN1 | |
| Manufacturer: | Suss Microtec | |
| Model: | LabSpin8 | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | SPIN1_2_SOP_2022.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Spin 100-200mm wafers, with a programmable controller, in a class 10 mini-environment, and a dedicated, electro-polished hotplate with automated wafer lift pins.
Details
(none given)
Materials Restrictions
(none)
Suss Spin Coater | 
| |
|---|---|---|
| Coral ID: | WNF--SPIN2 | |
| Manufacturer: | Suss Microtec | |
| Model: | LabSpin8 | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | SPIN1_2_SOP_2022.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Spin 100-200mm wafers, with a programmable controller, in a class 10 mini-environment, and a dedicated, electro-polished hotplate with automated wafer lift pins.
Details
(none given)
Materials Restrictions
(none)
Thinky Mixer | 
| |
|---|---|---|
| Coral ID: | WNF--Thinky-Mixer | |
| Manufacturer: | Thinky | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
The Thinky mixer is used to mix and degas PDMS.
Details
(none given)
Materials Restrictions
(none)
Vacuum Oven | 
| |
|---|---|---|
| Coral ID: | WNF--VacOven--Accutemp | |
| Manufacturer: | Across International | |
| Model: | ACCUTEMP-09 | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | Vacuum Drying Oven 20210505.pdf | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
Programmable vacuum oven with N2 backfill capability.
Details
Vacuum levels ranging from 1atm to ~0.5torr and equipped with an N2 backfill capability for inert environment. Operating temperature up to 250C, accuracy within +/- 1C. Can be programmed to automatically control a multi-segment drying process.
Materials Restrictions
(none)
YES Downstream Asher | 
| |
|---|---|---|
| Coral ID: | WNF--Etcher--Yes-Asher | |
| Manufacturer: | Yield Engineering Systems (YES) | |
| Model: | YES CV200 RFS | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | ASH2-YES_UserManual_v5.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
Downstream asher used to remove organics from various materials. Available process gases: O2, Argon, N2
Details
A heated, tray-load system, the YES Downstream Asher offers a high degree of process control with 3 available process gases. The tool has 4 standard recipes for thin film resist stripping, thick film resist stripping, and substrate descum. Users are requested to work with the tool owner to develop process specific recipes.
Materials Restrictions
Allowed etch target materials: Photoresist, e-beam resist, organic contaminants, some polymers (No SU8 nor PDMS.) No high-vapor-pressure materials. Please contact tool owner to discuss materials not included on this list.
YES HMDS Oven | 
| |
|---|---|---|
| Coral ID: | WNF--HMDS | |
| Manufacturer: | Yeild Enginerring Systems | |
| Model: | LP 3 A | |
| Lab: | WNF | |
| Area: | Lithography and Direct Patterning | |
| Manual: | HMDS_SOP_2024c.pdf | |
| UW Academic Rate: | $33/hr | |
| Industrial Rate: | $99/hr | |
| Outside Academic Rate: | $33/hr | |
Description
HMDS oven used for priming wafers prior to resist coating
Details
(none given)
Materials Restrictions
(none)
Other
Wafer Scriber | 
| |
|---|---|---|
| Coral ID: | WNF--Scriber--LatticeGear-FlipScribe | |
| Manufacturer: | LatticeGear | |
| Model: | FlipScribe | |
| Lab: | WNF | |
| Area: | Other | |
| UW Academic Rate: | $0/hr | |
| Industrial Rate: | $0/hr | |
| Outside Academic Rate: | $0/hr | |
Description
Manual scribing fixture for full and partial wafers, specifically designed for scribing the back side of the sample. Scribes across full wafers are possible, which is especially helpful for glass.
Details
4" wafer and small sample holders are available. Others are possible to obtain, please discuss specific needs with staff.
Materials Restrictions
Glass, sapphire, semiconductors. Dry samples only.
Packaging and Back End
Cascade Microtech M150 | 
| |
|---|---|---|
| Coral ID: | WNF--ProbeStation | |
| Manufacturer: | Cascade Microtech | |
| Model: | M150 | |
| Lab: | WNF | |
| Area: | Packaging and Back End | |
| UW Academic Rate: | $33/hr | |
| Industrial Rate: | $99/hr | |
| Outside Academic Rate: | $33/hr | |
Description
This manual probe station is typically used to measure conductivity, IV curves, and capacitance. It can be configured for many measurements and has a camera capable of recording video of moving MEMS devices.
Details
(none given)
Materials Restrictions
(none)
Disco Wafer Backgrinder | ||
|---|---|---|
| Coral ID: | WNF--Grinder--Disco | |
| Manufacturer: | Disco America | |
| Model: | DAG810 | |
| Lab: | WNF | |
| Area: | Packaging and Back End | |
| Manual: | DAG810_SOP1.2.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
Wafer backgrinder capable of bulk grinding and thinning of 200mm diameter wafers and smaller, including chips.
Details
(none given)
Materials Restrictions
No metals; wastestream safe materials only
Disco Wafer Dicer | 
| |
|---|---|---|
| Coral ID: | WNF--Saw--Disco | |
| Manufacturer: | Disco America | |
| Model: | DAD321 | |
| Lab: | WNF | |
| Area: | Packaging and Back End | |
| Manual: | DiscoDAD SOP 3.2.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Wafer dicing capable of 150mm diameter wafers and smaller.
Details
(none given)
Materials Restrictions
Silicon, glass, sapphire, other semiconductors crystalline structures. No bulk metal dicing; stack materials must be wastestream safe.
EVG Bonder | 
| |
|---|---|---|
| Coral ID: | WNF--Bonder--EVG | |
| Manufacturer: | EVG | |
| Model: | 501 | |
| Lab: | WNF | |
| Area: | Packaging and Back End | |
| Manual: | EVGBond_SOPv1.4.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
Thermal compression anodic bonding for Si and glass substrates.
Details
Configured for 100mm wafers.
Materials Restrictions
(none)
Finetech Fineplacer pico | 
| |
|---|---|---|
| Coral ID: | WNF--WireBonder--Flip-Chip | |
| Manufacturer: | Finetech | |
| Model: | Fineplacer pico | |
| Lab: | WNF | |
| Area: | Packaging and Back End | |
| Manual: | flipchip_SOP_2.1.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
This flip chip and die bonder can be used to place parts with better than 5um accuracy.
Details
(none given)
Materials Restrictions
(none)
Wafer Cleaver | .jpg)
| |
|---|---|---|
| Coral ID: | WNF--Cleaver--LatticeGear-AX420 | |
| Manufacturer: | LatticeGear | |
| Model: | AX420 | |
| Lab: | WNF | |
| Area: | Packaging and Back End | |
| Manual: | Cleaver - LatticeGear AX420 SOP 20180328.pdf | |
| UW Academic Rate: | $33/hr | |
| Industrial Rate: | $99/hr | |
| Outside Academic Rate: | $33/hr | |
Description
Precision diamond indentation and break station
Details
(none given)
Materials Restrictions
Recommended for single crystal semiconductor wafers
WEST-BOND Wire Bonder | 
| |
|---|---|---|
| Coral ID: | WNF--WestBond | |
| Manufacturer: | WestBond | |
| Model: | 4700E | |
| Lab: | WNF | |
| Area: | Packaging and Back End | |
| Manual: | Westbond wirebonder SOP 2.2 - CURRENT.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Wire bonding is used to electrically connect semiconductor devices with their packaging. The Westbond 4700E is a semiautomatic thermosonic ball-wedge wire bonder. It can be used to quickly lay down a succession of shaped electrical interconnects, or simple stud bumps for bonding chips using the flip chipper. The shaping and bonding of the wire is automated while the X-Y placement is manual, making it ideal for quickly generating testable prototypes and small batches of working devices.
The wire is 1 mil (25um) gold wire.
Details
(none given)
Materials Restrictions
(none)
Thin Film and Materials Characterization
Drop Gauge | 
| |
|---|---|---|
| Coral ID: | WNF--DropGauge | |
| Manufacturer: | HEIDENHAIN | |
| Model: | ND 281A | |
| Lab: | WNF | |
| Area: | Thin Film and Materials Characterization | |
| Manual: | DropGauge SOP 1.0.pdf | |
| UW Academic Rate: | $0/hr | |
| Industrial Rate: | $0/hr | |
| Outside Academic Rate: | $0/hr | |
Description
The drop gauge is a quick way to measure thickness of a sample. It has a range of 25 mm and an accuracy of 0.1 m. The system consists of a measuring probe, a vacuum chuck, motion control box, and a numerical display box for measurement readout.
Details
(none given)
Materials Restrictions
- Ensure substrates are clean and dry
- The measurement probe will press into soft materials, causing inaccuracy in measurements and potentially damage to sensitive features. Choose measurement area accordingly.
Filmetrics F40 Small Point Reflectometer | 
| |
|---|---|---|
| Coral ID: | WNF--Reflectometer--Filmetrics-F40 | |
| Manufacturer: | Filmetrics | |
| Model: | 210 | |
| Lab: | WNF | |
| Area: | Thin Film and Materials Characterization | |
| Manual: | Nanospec SOP 20170216.pdf | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
Single-point spectral reflectance to measure film thickness and refractive index.
Details
(none given)
Materials Restrictions
(none)
Four Dimensions Four-Point Probe Model 280 SI | 
| |
|---|---|---|
| Coral ID: | WNF--Probe--Four-Dimensions-280SI | |
| Manufacturer: | Four Dimensions | |
| Model: | 280 SI | |
| Lab: | WNF | |
| Area: | Thin Film and Materials Characterization | |
| Manual: | Four-Point Probe SOP.pdf | |
| UW Academic Rate: | $0/hr | |
| Industrial Rate: | $0/hr | |
| Outside Academic Rate: | $0/hr | |
Description
The Four Dimensions Four-Point Probe Model 280 SI is capable for making sheet resistivity measurements on various samples. It can map the sheet resistance of samples up to 8 inches in diameter. There are standard maps in the system and custom maps can be created.
Details
The four-point probe is used to measure conductivity of thin films and bulk material. A current is applied between the outer two probes and a voltage drop is measured between the middle two probes. This system is typically used to measure sheet resistivity, if the thickness of the conductive layers is known, sheet resistivity can be converted to bulk resistivity
Materials Restrictions
Make sure samples are dry and clean before loading them into the four-point probe. For samples thicker than a wafer, make sure the probe head will clear the sample.
Thin Film Processing
ALD chamber | 
| |
|---|---|---|
| Coral ID: | WNF--ALD02--Picosun-R200 | |
| Manufacturer: | Picosun | |
| Model: | R200 | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | ALD02 and ALD03 SOP 20250103.pdf | |
| UW Academic Rate: | $33/hr | |
| Industrial Rate: | $99/hr | |
| Outside Academic Rate: | $33/hr | |
Description
Picosun tool number 400309
MBraun glove box project #11939
Details
Existing processes: Al2O3, AlN, SiO2, ZrO2
Other processes available on request: HfO2, ZnO
Chips, 1 to 25 100mm wafers, 1 to 6 150mm wafers, or single 200mm wafer per run.
TDMACZ - tris(dimethylamino)cyclopentadienyl zirconium
BDEAS - bis(diethylamino)silane
TMA - trimethyl aluminum
TEMAH - tetrakis(ethylmethylamino) hafnium
Materials Restrictions
(none)
ALD chamber |
| |
|---|---|---|
| Coral ID: | WNF--ALD03--Picosun-R200 | |
| Manufacturer: | Picosun | |
| Model: | R200 | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | ALD02 and ALD03 SOP 20250103.pdf | |
| UW Academic Rate: | $33/hr | |
| Industrial Rate: | $99/hr | |
| Outside Academic Rate: | $33/hr | |
Description
Picosun tool number 400310
MBraun glove box project #11939
Details
Existing processes: Al2O3, AlN, Pt, TiO2, TiN
Other processes available on request: Ru
Chips, 1 to 25 100mm wafers, 1 to 6 150mm wafers, or single 200mm wafer per run.
Me3(MeCp)Pt or (3M)MCPt - trimethyl(methylcyclopentadienyl) platinum
(EtCp)2Ru or (EC)2Ru - bis(ethylcyclopentadienyl) ruthenium
TDMAT - tetrakis(dimethylamino) titanium
TMA - trimethyl aluminum
TiCl4 - titanium tetrachloride
Materials Restrictions
(none)
E-beam Evaporator 1 | 
| |
|---|---|---|
| Coral ID: | WNF--EVAP1 | |
| Manufacturer: | CHA | |
| Model: | SEC-600 | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | EVAP1 - SOP.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
EVAP1 is an electron beam evaporator for depositing metal films. It is cryopumped with a base pressure less than 2x10-6 Torr. The system holds 4 crucibles of metal, thus up to 4 metals can be subsequently deposited.
Details
The system has a capacity up to nine 100mm wafers in a planetary holder. Smaller pieces can be held by inserts. Typical evaporation sources are Ti, Au, Cr, Pt, Ag, Al, Pd, Cu, and Ni. Other sources are available. Precious metals (Au, Pt, and Pd) are charged by use. Users are welcome to request new materials and need to work with staff on developing proper recipes. The distance from the evaporation source to the wafer holder is about 19.5 inches.
Serial Number: 11199
Gold, palladium, and platinum must be checked out in Coral weighed before and after use. A scale for this is available next to the checkout cabinet. Make sure the gold crucible is placed on two carbon disks. The platinum crucible must make very good thermal contact with the hearth to avoid melting. Make sure the crucible fits all the way into the hearth with the top of the crucible flush with the hearth, and that the hearth is very clean before it is loaded.
Materials Restrictions
Only pure metals are recommended. The evaporation process typically does not allow for effective deposition of compound materials. Photoresist-coated substrates are allowed. Inorganic substrates are allowed in the system. Organic substrates may be allowed with staff permission.
E-beam Evaporator 2 | 
| |
|---|---|---|
| Coral ID: | WNF--EVAP2 | |
| Manufacturer: | CHA | |
| Model: | Solution | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | EVAP2 - SOP - 221004.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
The E-beam Evaporator is a metal evaporation system that uses an electron beam to heat the metal sources. The system has 6 pockets for different materials during deposition.
Pocket #1 is titanium, pocket #2 is chrome, Pocket #3 is gold, pocket #4 is platinum, pocked #5 is palladium or copper, and pocket #6 is aluminum.
The materials are put into crucible liners for better heat uniformity throughout the source material and to allow for easy removal and refilling. The vacuum system is produced via a cryopump as the high vacuum pump. There is a mechanical pump that is capable of roughing the chamber and regenerating the cryopump as needed.
Details
This system has a capacity of up to seven 100mm wafers when using the liftoff fixturing and fifteen 100mm wafers when using the planetary. It can also hold 3 200mm wafers in a planetary configuration. Holders for smaller pieces are also available. This system is the most automated of our evaporation systems and is capable of producing multilayer stacks without user intervention. Precious metals (Au, Pd, and Pt) are charged by use. This system also includes a heater so that depositions can be performed at up to 300 C and an ion mill to clean surfaces prior to deposition. The distance from the evaporation source to the wafer holder is about 14.5 inches.
System #6629 Solution
Make sure the gold crucible is placed on two carbon disks. The platinum crucible must make very good thermal contact with the hearth to avoid melting. Make sure the crucible fits all the way into the hearth with the top of the crucible flush with the hearth, and that the hearth is very clean before it is loaded.
Materials Restrictions
Most substrates are allowed. Consult a staff member prior to new processes on substrates other than glass, quartz, or silicon. Only pure metals are recommended. The evaporation process typically does not allow for effective deposition of compound materials. Photoresist is typically allowed, but ask a staff member prior to performing a new process.
Evatec LLS EVO Sputter System | 
| |
|---|---|---|
| Coral ID: | WNF--SPUT02 | |
| Manufacturer: | Evatec | |
| Model: | LLS EVO | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | SPUT01 SPUT02 SOP.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
This turbo pumped system with a cryo pumped load lock is used for batch sputter deposition of films.
Details
Up to ten wafers can be loaded into the system and deposited at the same time. Wafers are loaded vertically on panels and the system sputters horizontally. The system is plumbed with nitrogen and oxygen for reactive sputtering. The system can be setup for co-sputtering. The tool has a heater and an RF sputter etcher in the load lock.
Materials Restrictions
(none)
Evatec LLS EVO Sputter System | 
| |
|---|---|---|
| Coral ID: | WNF--SPUT01 | |
| Manufacturer: | Evatec | |
| Model: | LLS EVO | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | SPUT01 SPUT02 SOP.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
This turbo pumped system with a cryo pumped load lock is used for batch sputter deposition of films.
Details
Twelve wafers up to 6" diameter can be loaded into the system and deposited at the same time. Wafers are loaded vertically on panels and the system sputters horizontally. The system is plumbed with nitrogen and oxygen for reactive sputtering. The system can be setup for co-sputtering. The tool has a heater and an RF sputter etcher in the load lock.
Materials Restrictions
(none)
Expertech CTR200 Anneal Furnace | 
| |
|---|---|---|
| Coral ID: | WNF--Furnace--Anneal | |
| Manufacturer: | Expertech | |
| Model: | CTR200 | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | Atmospheric Furnace SOP 20180828.pdf | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
This atmospheric tube furnace is capable of both dry oxidation and annealing.
Details
This anneal furnace has a maximum temperature of 1000C. It is plumbed with nitrogen, oxygen, and forming gas (2% H2 in N2). It can accommodate 44 wafers with diameters up to 200 mm. Irregular samples can be arranged with staff.
Materials Restrictions
This furnace does allow wafers contaminated with metals. Materials must be robust at the maximum temperature called for in the recipe.
Expertech CTR200 Oxidation Furnace | 
| |
|---|---|---|
| Coral ID: | WNF--Furnace--Oxidation | |
| Manufacturer: | Expertech | |
| Model: | CTR200 | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | Atmospheric Furnace SOP 20180828.pdf | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
This atmospheric tube furnace is capable of both wet and dry oxidation.
Details
It has a maximum temperature of 1000C. It is plumbed with nitrogen, oxygen, and steam from a deionized water bubbler. It can accommodate 44 wafers with diameters up to 200 mm. Irregular samples can be arranged with staff.
Materials Restrictions
This furnace does not allow any metal-contaminated wafers. Wafers must be clean before oxidation.
Lesker Sputter | 
| |
|---|---|---|
| Coral ID: | WNF--SPUT03--Lesker | |
| Manufacturer: | Lesker | |
| Model: | Lab 18 | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | SPUT03 Lesker Sputter - SOP.pdf | |
| UW Academic Rate: | $77/hr | |
| Industrial Rate: | $231/hr | |
| Outside Academic Rate: | $77/hr | |
Description
This cryo pumped system is used for sputter deposition of films, with DC, RF, and pulsed DC power supplies. Targets materials include: Al, Ti, Au, Ti/W, Ni, ZnO, ITO, Nb, Cr, Cu, Ir, and Ni/Cr.
Details
Three sample holders are available for the system. There are holders for both 150mm and 4 inch wafers, plus a reconfigurable small-parts holder. Small parts must be of similar thickness to a wafer. Additional holders for specific samples can be fabricated.
The system has four power supplies. Power supply 1 (1500W max, DC) can be connected to guns 1, 2, 3, and 4. Power supply 4 (600W max, RF) can be connected to all five guns. Power supply 5 (1500W max, DC/pulsed DC) connects only to gun 5. Power supply 6 (100W max, RF) is used to bias the substrate. Only one power supply can connected to each gun at one time. Up to three guns can be sputtering at the same time if the guns are chosen carefully e.g. Gun 1 (DC), Gun 3 (RF), Gun 5 (DC) could be used for cosputtering.
Radio frequency (RF) supplies are used to counteract charge buildup that occurs on nonconducting targets. This is required for most oxides and nitrides used in the system. Conductive samples can be sputtered using an RF supply, but tend to sputter more slowly than with DC supplies.
Materials Restrictions
Organic substrates require staff review and permission prior to use. Photoresists are allowed in the system. Target placement must be reserved in advance by contacting darick@uw.edu. The target schedule is available here: http://goo.gl/fd0Gbh
Pulse Power Supply | 
| |
|---|---|---|
| Coral ID: | WNF--PPS | |
| Manufacturer: | Dynatronix | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | Pulse Power Suppy 20250116.pdf | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
Pulsed power supply for general electrodeposition processes.
This unit had originally been located in HOOD08 but was moved to HOOD10 when the GoldBath power supply failed.
Since HOOD08 has no designated power supply the electrode leads for the PPS must be plugged to the banana cable receptacles in HOOD10.
Details
(none given)
Materials Restrictions
(none)
Rapid Thermal Annealer |  (2).JPG)
| |
|---|---|---|
| Coral ID: | WNF--RTA-Clean | |
| Manufacturer: | Allwin32 | |
| Model: | AccuThermo AW 610 | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | RTA SOP 20171023.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Rapid thermal annealer
Details
Clean system isolation tube: 1119-16518 Clean system quartz tray: 1119-16534 General system isolation tube 1117-15748 General system quartz tray: 1210-13236 Backup set isolation tube: 819-16467 Backup set quartz tray: 1119-16531
Materials Restrictions
(none)
SCS Labcoter Parylene Deposition System | 
| |
|---|---|---|
| Coral ID: | WNF--Parylene | |
| Manufacturer: | SCS | |
| Model: | Labcoter | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | Parylene Coater SOP 20250103.pdf | |
| UW Academic Rate: | $33/hr | |
| Industrial Rate: | $99/hr | |
| Outside Academic Rate: | $33/hr | |
Description
The Labcoter is a parylene coating system used to cover samples with a conformal layer of parylene-c.
Details
(none given)
Materials Restrictions
(none)
SPTS PECVD | 
| |
|---|---|---|
| Coral ID: | WNF--PECVD2-SPTS | |
| Manufacturer: | SPTS | |
| Model: | SPM | |
| Lab: | WNF | |
| Area: | Thin Film Processing | |
| Manual: | PECVD2 SOP 20241014.pdf | |
| UW Academic Rate: | $55/hr | |
| Industrial Rate: | $165/hr | |
| Outside Academic Rate: | $55/hr | |
Description
Low temperature (125C) and high temperature (350C), high-rate PECVD of SiO, SiN, and amorphous-Si on up to 200mm substrates with dual frequency supplies for stress tuning.
Details
This system runs automated depositions by first conditioning the chamber, then running the deposition, and then cleaning. This makes the deposited films very repeatable and minimizes the need for systems shutdowns to clean the chamber.
Materials Restrictions
Because the system runs at high temperatures it is imperative that samples be compatible with those temperatures. Prior to deposition on low temperature materials or plastics, consult with staff.
Wet Etch and Cleaning
Critical Point Dryer | 
| |
|---|---|---|
| Coral ID: | WNF--CPD01-Tousimis | |
| Manufacturer: | Tousimis | |
| Model: | 931 | |
| Lab: | WNF | |
| Area: | Wet Etch and Cleaning | |
| Manual: | CPD_SOP_Feb2025.pdf | |
| UW Academic Rate: | $11/hr | |
| Industrial Rate: | $33/hr | |
| Outside Academic Rate: | $11/hr | |
Description
The Tousimis Critical Point Dryer (CPD) uses liquid carbon dioxide (LCO2) to dry and release fragile parts without damaging the structure due to surface tension.
Details
(none given)
Materials Restrictions
(none)
Developer Station | 
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|---|---|---|
| Coral ID: | WNF--BATH5-Develop | |
| Manufacturer: | WAFAB International | |
| Model: | 72" PVC-C Front Access Wet Bench (Developer Station) | |
| Lab: | WNF | |
| Area: | Wet Etch and Cleaning | |
| Manual: | BATH5-Develop_3.0.pdf | |
Description
Wet bench with dedicated baths for photoresist developers
Details
(none given)
Materials Restrictions
(none)
HF and BOE process station | 
| |
|---|---|---|
| Coral ID: | WNF--BATH3-HF-BOE | |
| Manufacturer: | WAFAB International | |
| Model: | 72" PVC-C Front Access Wet Station (HF/BOE Station) | |
| Lab: | WNF | |
| Area: | Wet Etch and Cleaning | |
| Manual: | BATH3-HF-BOE_3.0.pdf | |
| UW Academic Rate: | $0/hr | |
| Industrial Rate: | $0/hr | |
| Outside Academic Rate: | $0/hr | |
Description
Wet bench dedicated to processing with HF containing materials.
Details
Refilled by request
Materials Restrictions
(none)
KOH-TMAH Station | 
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|---|---|---|
| Coral ID: | WNF--BATH4-KOH-TMAH | |
| Manufacturer: | WAFAB International | |
| Model: | 72" Front Access Wet Bench (KOH/TMAH Station) | |
| Lab: | WNF | |
| Area: | Wet Etch and Cleaning | |
| Manual: | KOH_TMAH_Sept2022.pdf | |
Description
Wet bench with dedicated baths that can be used for KOH and TMAH.
Details
Both baths KOH. Please contact staff if TMAH processing is needed. Baths can be refilled by request
Materials Restrictions
(none)
Piranha Wet Bench | 
| |
|---|---|---|
| Coral ID: | WNF--BATH1-Piranha | |
| Manufacturer: | WAFAB International | |
| Model: | 72" PVC-C Front Access Wet Bench (Piranha Station) | |
| Lab: | WNF | |
| Area: | Wet Etch and Cleaning | |
| Manual: | BATH1-Piranha_2.0.pdf | |
Description
Wet bench with dedicated baths for piranha and Nanostrip
Details
Piranha changed monthly
Materials Restrictions
(none)
RCA Station: | 
| |
|---|---|---|
| Coral ID: | WNF--BATH2-RCA | |
| Manufacturer: | WAFAB International | |
| Model: | 72" PVC-C Front Access Wet Bench (RCA Station) | |
| Lab: | WNF | |
| Area: | Wet Etch and Cleaning | |
| Manual: | BATH2-RCA_2.0.pdf | |
Description
Wet bench dedicated to RCA Standard Clean 1 (SC1) and Standard Clean 2 (SC2)
Details
Turn on Heaters to reach operating temperature of 80C. Be sure to turn off heaters after use.
Baths Refilled upon Request. See Lab Status for latest Date.
SC1 (5:1:1 H2O:NH4OH:H2O2) -- Recommended change weekly.
SC2 (5:1:1 H2O:HCl:H2O2) -- Recommended change monthly
Materials Restrictions
(none)
Spin Rinse Dryer | .jpg)
| |
|---|---|---|
| Coral ID: | WNF--SRD1-6in | |
| Manufacturer: | Class One Technology | |
| Model: | Avenger Ultra-Pure | |
| Lab: | WNF | |
| Area: | Wet Etch and Cleaning | |
| Manual: | SRD SOP.pdf | |
Description
6 inch Wafer Rinse / Dryer
Details
(none given)
Materials Restrictions
(none)
Spin Rinse Dryer |
| |
|---|---|---|
| Coral ID: | WNF--SRD1-4in | |
| Manufacturer: | Class One Technology | |
| Model: | Avenger Ultra-Pure | |
| Lab: | WNF | |
| Area: | Wet Etch and Cleaning | |
| Manual: | SRD SOP.pdf | |
Description
4 inch Wafer Rinse / Dryer
Details
(none given)
Materials Restrictions
(none)