UW NNCI Site - WNF Lab Tool List


ABM Contact Aligner

Coral ID:WNF--Aligner--ABM
Manufacturer: AB-M
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/AB-M_UserManual_v2.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Contact photolithography exposure tool for 100mm wafers. An optimized process can achieve 2 um line/space patterns with a layer-to-layer registration accuracy about 3 um.

Details

(none given)

Materials Restrictions

Uses 5in or 7in square photomasks with 0.090in thickness. Configured for exposure of 100mm wafers; smaller chips can be accomodated using a carrier wafer.


Barrel Asher

Coral ID:WNF--Asher--BarrelEtch
Manufacturer: Glow Research
Model:AutoGlow
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/SOP_Barrel_Asher_v2b.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Barrel asher used to strip resist or other organic films, descum patterned resist, or clean surfaces of residual organics using an isotropic oxygen plasma.

Details

Accomodates substrate from chips up to 100mm diameter wafers.

Materials Restrictions

(none)


Bruker DektakXT Contact Profilometer

Coral ID:WNF--Profilometer--Dektak-XT
Manufacturer: Bruker
Model:WNF--Profilometer--Dektak-XT
Lab:WNF
Area:Inspection
Manual:https://coral.engr.washington.edu/upload/manuals/DektakXT SOP 20190523 Full.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

This is a contact profilometer capable of measuring step heights that range from tens of nanometers to one millimeter. It can also measure surface roughness and film stress. It can accommodate 100mm, 125 mm, and 150 mm wafers as well as smaller chips. It is capable of automated measurements with step detection. The stylus has a radius of 2 um and a cone angle of 60 degrees.

Details

(none given)

Materials Restrictions

(none)


Canon Stepper

Coral ID:WNF--Stepper--Canon-5X
Manufacturer: Canon
Model:FPA-3000 i4
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/Stepper SOP.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

Non-contact photolithography exposure tool for 100mm and 200mm wafers. An optimized process can achieve 350nm features with a stepping accuracy of 40nm.

Details

Wafer Size: 8” or 4” SEMI Standard, JEIDA,Notch / Flat | Reticle: Standard Size 6" | Projection Magnification: 5X | Exposure Light: 365nm | Intensity: >6500W/m2 | Uniformity: < 2.0% | Field Size: 22x26mm | Masking Blade: Blades Independent (0.4X0.4mm~26X26mm on wafer) | Resolution: 0.35µm | Depth of Focus: >1.0µm | Image Field Deviation: <0.5µm | Distortion: <±0.05µm | Alignment Lighting Source: He-Ne Laser, Broad Band(Halogen Lamp) | Alignment System: Off Axis TTL | Alignment Mode: AGA | Step Accuracy: <0.04µm (3sigma) | Scaling: <±0.5ppm | Orthogonality: <±0.5ppm | Reticle Rotation Accuracy: <±0.015µm | Cleanness: Class 1(>0.1µm) | Wafer Bow: <40um

Materials Restrictions

(none)


Cascade Microtech M150

Coral ID:WNF--ProbeStation
Manufacturer: Cascade Microtech
Model:M150
Lab:WNF
Area:Packaging and Back End
UW Academic Rate: $30/hr
Industrial Rate: $90/hr
Outside Academic Rate: $30/hr

Description

This manual probe station is typically used to measure conductivity, IV curves, and capacitance. It can be configured for many measurements and has a camera capable of recording video of moving MEMS devices.

Details

(none given)

Materials Restrictions

(none)


DWL66+ Direct Write

Coral ID:WNF--MaskWriter--Heidelberg-DWL66plus
Manufacturer: Heidelberg
Model:DWL66+
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/DWL66Plus Mask SOP.pdf
UW Academic Rate: $30/hr
Industrial Rate: $90/hr
Outside Academic Rate: $30/hr

Description

Create masks or direct write on substrates with alignment capability utilizing a 405nm laser. Write modes Type II (4mm head with 0.8um minimum feature) and IV (20mm head with 2um minimum feature) available.

Details

(none given)

Materials Restrictions

(none)


Deep Reactive Ion Etcher

Coral ID:WNF--DRIE1--Oxford
Manufacturer: Oxford Instruments
Model:ICP 380
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/ICP1-DRIE-Oxford_SOPv2.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

Deep Reactive Ion Etch system for etching silicon using a Bosch-etch process of alternating SF6 and C4F8 gases to achieve high etch rate, high aspect ratio structures.

Details

100mm wafers, silicon only. Mask materials SiO2 (150:1 selectivity) or Photoresist (60:1) only. No exposed metal.

Materials Restrictions

Silicon wafers only, with SiO2 or photoresist masks only. No exposed metals. Through-wafer etches require use of a carrier wafer.


Developer Station

Coral ID:WNF--BATH5-Develop
Manufacturer: WAFAB International
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/BATH5-Develop_3.0.pdf

Description

Wet bench with dedicated baths for photoresist developers

Details

(none given)

Materials Restrictions

(none)


Disco Wafer Dicer

Coral ID:WNF--Saw--Disco
Manufacturer: Disco America
Model:DAD321
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/201308_Disco_SOP.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Wafer dicing capable of 150mm diameter wafers and smaller.

Details

(none given)

Materials Restrictions

(none)


E-Beam Lithography

Coral ID:WNF--EBL--JEOL-JBX6300FS
Manufacturer: JEOL
Model:JBX6300FS
Lab:WNF
Area:Lithography and Direct Patterning
UW Academic Rate: $125/hr
Industrial Rate: $450/hr
Outside Academic Rate: $125/hr

Description

Direct-write 100 kV Electron Beam Lithography capable of feature sizes as small as 10 nm, and layer-to-layer registration better than ~30 nm m+3s.

Details

Substrates from small chips to 150mm wafers. A wide range of beam currents, choice of two objective lenses, and a wide range of resist processes provide significant flexibility for a variety of needs. Sophisticated data preparation software provides advanced functions including full shape and dose proximity correction.

Materials Restrictions

(none)


E-beam Evaporator 1

Coral ID:WNF--EVAP1
Manufacturer: CHA
Model:SEC-600
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/EVAP1 - SOP.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

EVAP1 is an electron beam evaporator for depositing metal films. It is cryopumped with a base pressure less than 2x10-6 Torr. The system holds 4 crucibles of metal, thus up to 4 metals can be subsequently deposited.

Details

The system has a capacity up to nine 100mm wafers in a planetary holder. Smaller pieces can be held by inserts. Typical evaporation sources are Ti, Au, Cr, Pt, Ag, Al, Pd, Cu, and Ni. Other sources are available. Precious metals (Au, Pt, and Pd) are charged by use. Users are welcome to request new materials and need to work with staff on developing proper recipes. The distance from the evaporation source to the wafer holder is about 19.5 inches.
Serial Number: 11199
Gold, palladium, and platinum must be weighed before and after use. A scale for this is available next to the checkout sheet. Make sure the gold crucible is placed on two carbon disks. The platinum crucible must make very good thermal contact with the hearth to avoid melting. Make sure the crucible fits all the way into the hearth with the top of the crucible flush with the hearth, and that the hearth is very clean before it is loaded.

Materials Restrictions

Only pure metals are recommended. The evaporation process typically does not allow for effective deposition of compound materials. Photoresist-coated substrates are allowed. Inorganic substrates are allowed in the system. Organic substrates may be allowed with staff permission.


E-beam Evaporator 2

Coral ID:WNF--EVAP2
Manufacturer: CHA
Model:Solution
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/EVAP2 - SOP.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

The E-beam Evaporator is a metal evaporation system that uses an electron beam to heat the metal sources. The system has 6 pockets for different materials during deposition. Pockets #1 is titanium, pocket #2 is chrome, pocket #3 is gold, pocket #4 is platinum, pocked #5 is palladium or copper, and pocket #6 is aluminum. The materials are put into crucible liners for better heat uniformity throughout the source material and to allow for easy removal and refilling. The vacuum system is produced via a cryopump as the high vacuum pump. There is a mechanical pump that is capable of roughing the chamber and regenerating the cryopump as needed.

Details

This system has a capacity of up to seven 100mm wafers when using the liftoff fixturing and fifteen 100mm wafers when using the planetary. It can also hold 3 200mm wafers in a planetary configuration. Holders for smaller pieces are also available. This system is the most automated of our evaporation systems and is capable of producing multilayer stacks without user intervention. Precious metals (Au, Pd, and Pt) are charged by use. This system also includes a heater so that depositions can be performed at up to 300 C and an ion mill to clean surfaces prior to deposition. The distance from the evaporation source to the wafer holder is about 14.5 inches.
System #6629 Solution
Gold, palladium, and platinum must be weighed before and after use. A scale for this is available next to the checkout sheet. Make sure the gold crucible is placed on two carbon disks. The platinum crucible must make very good thermal contact with the hearth to avoid melting. Make sure the crucible fits all the way into the hearth with the top of the crucible flush with the hearth, and that the hearth is very clean before it is loaded.

Materials Restrictions

Most substrates are allowed. Consult a staff member prior to new processes on substrates other than glass, quartz, or silicon. Only pure metals are recommended. The evaporation process typically does not allow for effective deposition of compound materials. Photoresist is typically allowed, but ask a staff member prior to performing a new process.


EVG Aligner

Coral ID:WNF--Aligner--EVG
Manufacturer: EVG
Model:620
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/EVG-Aligner.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Contact photolithography tool for exposure of 100mm wafers. An optimized process can achieve 2 um line/space patterns with a layer-to-layer registration accuracy about 3 um. Backside alignment is possible using a second set of alignment optics.

Details

Uses 5in square photomasks with 0.090in thickness. Configured for exposure of 100mm wafers; smaller chips can be accomodated using a carrier wafer.

Materials Restrictions

(none)


EVG Bonder

Coral ID:WNF--Bonder--EVG
Manufacturer: EVG
Model:501
Lab:WNF
Area:Packaging and Back End
Manual:https://coral.engr.washington.edu/upload/manuals/EVGBond.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

Thermal compression anodic bonding for Si and glass substrates.

Details

Configured for 100mm wafers.

Materials Restrictions

(none)


Electroplating Bath

Coral ID:WNF--Electrodeposition--BOAS
Manufacturer: WaferPower
Model:Beaker-on-a-Stick
Lab:WNF
Area:Thin Film Processing
Manual:https://coral.engr.washington.edu/upload/manuals/Electrodeposition - Beaker on a Stick SOP 20190109.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Electroplating Bath

Details

Single shot electroplating setup for 100 mm wafers

Materials Restrictions

Authorized chemistries to date: Cu-acid, SnAg (sulfamate), In (sulfamate). Contact staff to discuss new chemistries.


Electroplating Bath

Coral ID:WNF--Electrodeposition--ClassOne-Solstice
Manufacturer: Class One
Model:SLT-ECD
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/CopperBath SOP 20180316.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Electrodeposition of metals, plus wetting station and spin rinse dryer.

Details

(none given)

Materials Restrictions

Plating chemistry compatible photoresists (e.g. AZ 9260) and exposed seed layer metals (Au, Cu, etc.). Contact staff for more details and to evaluate alternative chemistries.


Evatec LLS EVO Sputter System

Coral ID:WNF--SPUT01
Manufacturer: Evatec
Model:LLS EVO
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/SPUT1 SPUT2 SOP (1).pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

This turbo pumped system with a cryo pumped load lock is used for batch sputter deposition of films. It can be used to sputter Ta, Pt, Cu, Al, and Ti.

Details

Multiple wafers can be loaded into the system and deposited at the same time. Wafers are loaded vertically on panels and the system sputters horizontally. The system is plumbed with nitrogen and oxygen for reactive sputtering. The system can be setup for co-sputtering. The tool has a heater and an RF sputter etcher in the load lock.

Materials Restrictions

(none)


Evatec LLS EVO Sputter System

Coral ID:WNF--SPUT02
Manufacturer: Evatec
Model:LLS EVO
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/SPUT1 SPUT2 SOP (1).pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

This turbo pumped system with a cryo pumped load lock is used for batch sputter deposition of films. It can be used to sputter ITO, WTi, Cr, Au, and ZnO.

Details

Multiple wafers can be loaded into the system and deposited at the same time. Wafers are loaded vertically on panels and the system sputters horizontally. The system is plumbed with nitrogen and oxygen for reactive sputtering. The system can be setup for co-sputtering. The tool has a heater and an RF sputter etcher in the load lock.

Materials Restrictions

(none)


Expertech CTR200 Anneal Furnace

Coral ID:WNF--Furnace--Anneal
Manufacturer: Expertech
Model:CTR200
Lab:WNF
Area:Thin Film Processing
Manual:https://coral.engr.washington.edu/upload/manuals/Atmospheric Furnace SOP 20180828.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

This atmospheric tube furnace is capable of both dry oxidation and annealing.

Details

This anneal furnace has a maximum temperature of 1000C. It is plumbed with nitrogen, oxygen, and forming gas (2% H2 in N2). It can accommodate 44 wafers with diameters up to 200 mm. Irregular samples can be arranged with staff.

Materials Restrictions

This furnace does allow wafers contaminated with metals. Materials must be robust at the maximum temperature called for in the recipe.


Expertech CTR200 Oxidation Furnace

Coral ID:WNF--Furnace--Oxidation
Manufacturer: Expertech
Model:CTR200
Lab:WNF
Area:Thin Film Processing
Manual:https://coral.engr.washington.edu/upload/manuals/Atmospheric Furnace SOP 20180828.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

This atmospheric tube furnace is capable of both wet and dry oxidation.

Details

It has a maximum temperature of 1000C. It is plumbed with nitrogen, oxygen, and steam from a deionized water bubbler. It can accommodate 44 wafers with diameters up to 200 mm. Irregular samples can be arranged with staff.

Materials Restrictions

This furnace does not allow any metal-contaminated wafers. Wafers must be clean before oxidation.


Filmetrics F40 Small Point Reflectometer

Coral ID:WNF--Reflectometer--Filmetrics-F40
Manufacturer: Filmetrics
Model:210
Lab:WNF
Area:Thin Film and Materials Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/Nanospec SOP 20170216.pdf
UW Academic Rate: $10/hr
Industrial Rate: $30/hr
Outside Academic Rate: $10/hr

Description

Single-point spectral reflectance to measure film thickness and refractive index.

Details

(none given)

Materials Restrictions

(none)


Filmetrics F50 Thin Film Reflectometer

Coral ID:WNF--Reflectometer--Filmetrics-F50
Manufacturer: Filmetrics
Model:F50
Lab:WNF
Area:Device and Structure Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/FilmetricsUserInstructions_V1.0.pdf
UW Academic Rate: $10/hr
Industrial Rate: $30/hr
Outside Academic Rate: $10/hr

Description

Optical measurement of thin film layers on various substrates. Uses spectral reflectance to determine film thickness, refractive index, and extinction coefficient by scanning wavelengths from 200 to 1700 nm. Substrates up to 150 mm can be mapped automatically.

Details

(none given)

Materials Restrictions

(none)


Finetech Fineplacer pico

Coral ID:WNF--WireBonder--Flip-Chip
Manufacturer: Finetech
Model:Fineplacer pico
Lab:WNF
Area:Packaging and Back End
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

This flip chip and die bonder can be used to place parts with better than 5um accuracy.

Details

(none given)

Materials Restrictions

(none)


Four Dimensions Four-Point Probe Model 280 SI

Coral ID:WNF--Probe--Four-Dimensions-280SI
Manufacturer: Four Dimensions
Model:280 SI
Lab:WNF
Area:Thin Film and Materials Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/Four-Point Probe SOP.pdf
UW Academic Rate: $0/hr
Industrial Rate: $0/hr
Outside Academic Rate: $0/hr

Description

The Four Dimensions Four-Point Probe Model 280 SI is capable for making sheet resistivity measurements on various samples. It can map the sheet resistance of samples up to 8 inches in diameter. There are standard maps in the system and custom maps can be created.

Details

The four-point probe is used to measure conductivity of thin films and bulk material. A current is applied between the outer two probes and a voltage drop is measured between the middle two probes. This system is typically used to measure sheet resistivity, if the thickness of the conductive layers is known, sheet resistivity can be converted to bulk resistivity

Materials Restrictions

Make sure samples are dry and clean before loading them into the four-point probe. For samples thicker than a wafer, make sure the probe head will clear the sample.


Gas Panel Delivery System (Ammonia)

Coral ID:WNF--Panel--NH3
Manufacturer: Prax Air
Lab:WNF
Area:Other

Description

Gas Cabinet With NH3 Panel

Details

(none given)

Materials Restrictions

(none)


HF and BOE process station

Coral ID:WNF--BATH3-HF-BOE
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/BATH3-HF-BOE_3.0.pdf
UW Academic Rate: $0/hr
Industrial Rate: $0/hr
Outside Academic Rate: $0/hr

Description

Wet bench dedicated to processing with HF containing materials.

Details

Refilled by request

Materials Restrictions

(none)


Heidelberg Mask Writer

Coral ID:WNF--MaskWriter--Heidelberg-MicroPG-101
Manufacturer: Heidelberg Instruments
Model:uPG 101
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/201403 Heidelberg uPG101 Mask Writer.pdf
UW Academic Rate: $30/hr
Industrial Rate: $90/hr
Outside Academic Rate: $30/hr

Description

An extremely economical and easy to use micro pattern generator for low volume mask making and direct writing applications

Details

(none given)

Materials Restrictions

Allows substrate between 50-125mm, no thicker than 6mm, and surface roughness less than or equal to +/- 20um.


ICP-Chlorine

Coral ID:WNF--ICP--Oxford-Chlorine
Manufacturer: Oxford
Model:PlasmaLab 100, ICP-180
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/ICP3-Cl-Oxford_UserManual_v3d.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

Highly anisotropic Inductively Coupled Plasma (ICP) etching using chlorine-based etch chemistries for etching Silicon, III-V semiconductors, aluminum and chrome. Load-locked for rapid load/unload and high process consistency.

Details

Process gases: BCl3, Cl2, H2, N2, O2, CH4, SF6, and Ar. A heated stage allows etching at substrates temperatures up to 250 C. 100mm wafers only. Smaller sizes can be accomodated using a 100mm silicon wafer as a carrier wafer. NOTE: As of 4/8/2019, ICP-C process chamber is heated to 60C. It is expected this new and permanent etch-chamber environment will affect the performance of current etch recipes and some recipe re-development will be required. TEST your old recipes and re-develop as required BEFORE committing product wafers to the tool.

Materials Restrictions

Metal masks not allowed. No exposed noble metals.


ICP-Fluorine

Coral ID:WNF--ICP--Oxford-Fluorine
Manufacturer: Oxford
Model:PlasmaLab 100, ICP-180
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/ICP2-F-Oxford_UserManual_v7.4.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

Capable of highly anisotropic Inductively/Capacitively Coupled Plasma (ICP/CCP) etching using fluorine-based etch chemistries. Additionally, isotropic etching is available via ICP-only configuration. Load-locked for rapid load/unload and high process consistency. An LN2-cooled stage provides cryo-etching capabilities. NOTE: New chamber cleaning policy: all chamber cleaning must be done with the system enabled and, at intervals of no more than 15 minutes, users must confirm the clean process continues to run to completion without error. The tool may be disabled only if there is less than 15 minutes left on the clean.

Details

Materials etched include Silicon, Silicon Dioxide, Silicon Nitride, and refractory metals including Tungsten, Titanium, Molybdenum, and Niobium. Process gases: C4F8, CHF3, N2, O2, Ar, and SF6. 100mm wafers only. Smaller sizes can be accomodated using a 100mm silicon wafer as a carrier wafer.

Materials Restrictions

Metal masks only allowed for etches with a bias voltage <50V. No dirty glass can be etched (<99% SiO2), ie no pyrex, no borosilicate, no soda-lime.


JEOL-SEM

Coral ID:WNF--SEM--JEOL-JSM7400F
Manufacturer: JEOL
Model:JSM7400F
Lab:WNF
Area:Device and Structure Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/JSM7400F_SEM_user_instructions_2.0.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

Very high-resolution cold field emission Scanning Electron Microscope (SEM), provides imaging down to a few nm. Conventional, in-lens and backscattered electron detectors are available.

Details

A load-lock allows fast sample exchange and maintains a clean chamber for better high-resolution imaging. A variety of sample holders for mounting substrates from small chips up to 100mm wafers. Tilt angle range depends on substrate size and working distance.

Materials Restrictions

Clean, low-outgassing substrates only. No magnetic samples.


KLA Tencor P15 Contact Profilometer

Coral ID:WNF--Profilometer--P15
Manufacturer: Tencor
Model:P-15
Lab:WNF
Area:Device and Structure Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/P15.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

A surface profilometer for physical measurement of topography on wafers. Can program a sequence of locations to scan, providing 2-D and pseudo-3-D measurement of topography, as well as calculation of film stress. Step heights down to tens of nanometers are possible.

Details

(none given)

Materials Restrictions

(none)


KOH-TMAH Station

Coral ID:WNF--BATH4-KOH-TMAH
Manufacturer: WAFAB International
Lab:WNF
Area:Wet Etch and Cleaning
Manual:https://coral.engr.washington.edu/upload/manuals/BATH4-KOH-TMAH_3.1.pdf

Description

Wet bench with dedicated baths for KOH and TMAH

Details

Refilled by request

Materials Restrictions

(none)


Keyence Laser Scanning Confocal Microscope

Coral ID:WNF--Confocal-Microscope--Keyence-VK-X150K
Manufacturer: Keyence
Model:VK-X150K
Lab:WNF
Area:Inspection
Manual:https://coral.engr.washington.edu/upload/manuals/Keyence_SOP1_1.pdf
UW Academic Rate: $10/hr
Industrial Rate: $30/hr
Outside Academic Rate: $10/hr

Description

This laser scanning confocal microscope obtains 3D measurements from a wafer surface for measurement of both step heights and lateral dimensions. This model uses a red (658 nm) laser. The step height measurement has a resolution of 5 nm with a minimum step height of 50 nm. Lateral measurements have a resolution of 250 nm.

Details

(none given)

Materials Restrictions

(none)


Leica DVM2500 digital microscope

Coral ID:WNF--Microscope--Leica-Backend
Manufacturer: Leica
Model:DVM2500
Lab:WNF
Area:Inspection
UW Academic Rate: $10/hr
Industrial Rate: $30/hr
Outside Academic Rate: $10/hr

Description

This digital microscope is capable of variable angles, has a long working distance, and has magnification from 20x to 160x,

Details

(none given)

Materials Restrictions

(none)


Leica Microscope

Coral ID:WNF--Microscope--Leica
Manufacturer: Leica / Reichert
Model:Polylite 88
Lab:WNF
Area:Inspection
UW Academic Rate: $10/hr
Industrial Rate: $30/hr
Outside Academic Rate: $10/hr

Description

General-purpose wafer inspection microscope with digital camera. The microscope is capable of Nomarski imaging/DIC and has a stage that can accommodate wafers up to 150 mm.

Details

(none given)

Materials Restrictions

(none)


Leitz Optical Microscope

Coral ID:WNF--Microscope--Leitz
Manufacturer: Leitz
Lab:WNF
Area:Inspection
UW Academic Rate: $10/hr
Industrial Rate: $30/hr
Outside Academic Rate: $10/hr

Description

Older, bare-bones microscope for quick, simple inspection.

Details

(none given)

Materials Restrictions

(none)


Lesker Sputter

Coral ID:WNF--SPUT03--Lesker
Manufacturer: Lesker
Model:Lab 18
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/LeskerSputter - SOP.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

This cryo pumped system is used for sputter deposition of films, with DC, RF, and pulsed DC power supplies. Targets materials include: Al, Ti, Au, Ti/W, Ni, ZnO, ITO, Nb, Cr, Cu, Ir, and Ni/Cr.

Details

Three sample holders are available for the system. There are holders for both 6in and 100mm wafers, plus a reconfigurable small-parts holder. Small parts must be of similar thickness to a wafer. Additional holders for specific samples can be fabricated.

The system has four power supplies. Power supply 1 (1500W max, DC) can be connected to guns 1, 2, 3, and 4. Power supply 4 (600W max, RF) can be connected to all five guns. Power supply 5 (1500W max, DC/pulsed DC) connects only to gun 5. Power supply 6 (100W max, RF) is used to bias the substrate. Only one power supply can connected to each gun at one time. Up to three guns can be sputtering at the same time if the guns are chosen carefully e.g. Gun 1 (DC), Gun 3 (RF), Gun 5 (DC) could be used for cosputtering.

Radio frequency (RF) supplies are used to counteract charge buildup that occurs on nonconducting targets. This is required for most oxides and nitrides used in the system. Conductive samples can be sputtered using an RF supply, but tend to sputter more slowly than with DC supplies.

Materials Restrictions

Organic substrates require staff review and permission prior to use. Photoresists are allowed in the system. Target placement must be reserved in advance by contacting darick@uw.edu. The target schedule is available here: http://goo.gl/fd0Gbh


Nanoscribe Photonic Professional GT

Coral ID:WNF--Nanoscribe-Photonic-Professional-GT
Manufacturer: Nanoscribe
Model:Photonic Professional (GT)
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/User_Manual_digital.pdf
UW Academic Rate: $10/hr
Industrial Rate: $30/hr
Outside Academic Rate: $10/hr

Description

3D printing platform for micro- and nanofabrication demands utilizing two-photon polymerization. Structures can either be designed in 3D printer compatible CAD software programs or directly implemented in Nanoscribe’s GWL scripting language.

Details

(none given)

Materials Restrictions

(none)


Nikon Semiconductor Optical Microscope

Coral ID:WNF--Microscope--Nikon
Manufacturer: Optiphot
Model:200
Lab:WNF
Area:Inspection
Manual:https://coral.engr.washington.edu/upload/manuals/201309 Nikon Microscope.pdf
UW Academic Rate: $10/hr
Industrial Rate: $30/hr
Outside Academic Rate: $10/hr

Description

This optical microscope including dark-field imaging, LED light sources for both reflected and transmitted illumination, and a camera for image capture. The stage can accommodate wafers up to 200 mm in diameter as well as irregular samples.

Details

(none given)

Materials Restrictions

(none)


Oxford OpAL ALD

Coral ID:WNF--ALD--Oxford-OpAL
Manufacturer: Oxford Instruments
Model:Plasmalab 80Plus OpAL ALD
Lab:WNF
Area:Thin Film Processing
Manual:https://coral.engr.washington.edu/upload/manuals/ALD01 - Oxford OpAL ALD SOP.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

This atomic layer deposition (ALD) system deposits layers of material monolayer by monolayer. It has been used recently to deposit Al2O3 and HfO2.

Details

This system provides precise growth control over thin films. Layers have been used as dielectrics and mask layers. Processes can be run in either the plasma-ALD or thermal-ALD modes. At this point only the Al2O3 precursor is available. Run temperatures range from 50C to 300C.

Materials Restrictions

This system can accommodate up to 200mm wafers. The chamber opens for loading so numerous smaller pieces can be arranged inside the system.


Piranha Wet Bench

Coral ID:WNF--BATH1-Piranha
Lab:WNF
Area:Wet Etch and Cleaning
Manual:https://coral.engr.washington.edu/upload/manuals/BATH1-Piranha_2.0.pdf

Description

Wet bench with dedicated baths for piranha and Nanostrip

Details

Piranha changed monthly

Materials Restrictions

(none)


Plasma Enhanced CVD

Coral ID:WNF--PECVD1-Oxford
Manufacturer: Oxford Instruments
Model:Plasma Lab 100
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/PECVD1-SOP.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Plasma-Enhanced Chemical Vapor Deposition (PECVD) of Silicon Dioxide, Silicon Nitride, Silicon Oxynitride and amorphous silicon. Dual-frequency power supply provides enhanced stress control in nitride films.

Details

Wafers up to 8in. Smaller chips can be accomodated using a 100mm silicon wafer as a carrier wafer.

Materials Restrictions

Samples going into the chamber must not contaminate the chamber or contain materials that will decompose at 350C.


Plating Bath Additive Analyzer

Coral ID:WNF--Bath-Analyzer
Manufacturer: ECI Technology
Model:QL-10EZ
Lab:WNF
Area:Packaging and Back End
Manual:https://coral.engr.washington.edu/upload/manuals/ECI Plating Bath Analyzer SOP 20180306.pdf
UW Academic Rate: $0/hr
Industrial Rate: $0/hr
Outside Academic Rate: $0/hr

Description

Cyclic voltammetric stripping (CVS) and cyclic pulsed voltammetric stripping (CPVS) analysis for measuring additive concentrations in CuSO4 acid electroplating solutions.

Details

(none given)

Materials Restrictions

(none)


Poly-silicon LPCVD

Coral ID:WNF--Furnace--LPCVD
Manufacturer: Expertech
Model:CTR200
Lab:WNF
Area:Thin Film Processing
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Poly-silicon low-pressure chemical vapor deposition

Details

This tube is currently for depositing undoped poly-silicon.

Materials Restrictions

No metals


RCA Station

Coral ID:WNF--BATH2-RCA
Manufacturer: WAFAB International
Lab:WNF
Area:Wet Etch and Cleaning
Manual:https://coral.engr.washington.edu/upload/manuals/BATH2-RCA_2.0.pdf

Description

Wet bench dedicated to the RCA cleaning process.

Details

Refilled weekly

Materials Restrictions

(none)


Rapid Thermal Annealer

Coral ID:WNF--RTA-Clean
Manufacturer: Allwin32
Model:AccuThermo AW 610
Lab:WNF
Area:Thin Film Processing
Manual:https://coral.engr.washington.edu/upload/manuals/RTA SOP 20171023.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Rapid thermal annealer

Details

(none given)

Materials Restrictions

(none)


Reactive Ion Etcher 1

Coral ID:WNF--RIE1--Vision
Manufacturer: Vision
Model:Vision 320 RIE Mark II
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/RIE1-AV_UserManual_v4.2.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

A parallel-plate Reactive Ion Etch (RIE) system. Open load for flexible substrate handling. Etch gases are: Ar, CF4, CHF3, N2, O2, and SF6.

Details

Open load, so any size substrates are allowed.

Materials Restrictions

No etching of metal films, and no etching of dirty glasses (<99% SiO2) allowed. Exposed metal is allowed as long as it is not being etched. Etching down to metal pads is allowed as long as the pads are not etched.


Reactive Ion Etcher 2

Coral ID:WNF--RIE2--Vision
Manufacturer: Advanced Vacuum
Model:Vision 320 MkII
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/RIE2-AV_UserManual_v1c.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

A parallel-plate Reactive Ion Etch (RIE) system. Open load for flexible substrate handling. Etch gases are: Ar, CF4, CHF3, N2, O2, and SF6. This the designated clean RIE tool - Allowed materials are strictly enforced.

Details

(none given)

Materials Restrictions

Etch targets are limited to: silicon, silicon nitride, silicon oxide, photoresist. Allowed mask materials: photoresist, ebeam-resist, oxide, nitride, alumina. Exposed metal is not allowed. Please contact the tool owner to discuss alternatives for disallowed materials.


Rite Track Automated Coater

Coral ID:WNF--Coater--Rite-Track-SVG90S
Manufacturer: Rite Track
Model:SVG-90S
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/Rite Track SVG90S SOP.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

Automated coater cluster tool with 100mm, 150mm and 200mm capability. Auto dispenses AZ1512, AZ9260, AZ701 and NR-9 3000 photoresists. Recipes often utilize frontside and backside EBR. Modules include: HMDS vapor prime, coater, cold plate and two vacuum bake ovens.

Details

(none given)

Materials Restrictions

(none)


Rite Track Automated Developer

Coral ID:WNF--Developer--Rite-Track-SVG90S
Manufacturer: Rite Track
Model:SVG-90S
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/Rite Track SVG90S SOP.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

Automated developer cluster tool with 100mm, 150mm and 200mm capability. Auto dispenses AD10MIF and AZ400K developers. Recipes utilize frontside and backside DI water rinse. Modules include: vacuum bake, cold plate, developer.

Details

(none given)

Materials Restrictions

(none)


SCS 6808P spin coater

Coral ID:WNF--SPIN5
Manufacturer: WAFAB
Model:48" SST Front Acess Wet Bench
Lab:WNF
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Flexible, manual bench-top spin coater with vacuum chucks available for pieces from a few mm up to 150 mm wafers.

Details

(none given)

Materials Restrictions

(none)


SCS Labcoter Parylene Deposition System

Coral ID:WNF--Parylene
Manufacturer: SCS
Model:Labcoter
Lab:WNF
UW Academic Rate: $30/hr
Industrial Rate: $90/hr
Outside Academic Rate: $30/hr

Description

The Labcoter is a parylene coating system used to cover samples with a conformal layer of parylene-c.

Details

(none given)

Materials Restrictions

(none)


SPTS PECVD

Coral ID:WNF--PECVD2-SPTS
Manufacturer: SPTS
Model:SPM
Lab:WNF
Area:Thin Film Processing
Manual:https://coral.engr.washington.edu/upload/manuals/PECVD2-SOP.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Low temperature (125C) and high temperature (350C), high-rate PECVD of SiO, SiN, and amorphous-Si on up to 200mm substrates with dual frequency supplies for stress tuning.

Details

This system runs automated depositions by first conditioning the chamber, then running the deposition, and then cleaning. This makes the deposited films very repeatable and minimizes the need for systems shutdowns to clean the chamber.

Materials Restrictions

Because the system runs at high temperatures it is imperative that samples be compatible with those temperatures. Prior to deposition on low temperature materials or plastics, consult with staff.


SPTS Silicon DRIE

Coral ID:WNF--DRIE2--SPTS
Manufacturer: SPTS
Model:Rapier Si_DRIE
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/ICP4-SPTS-DSi_v5e.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

The SPTS Rapier is a highly functional inductively coupled ion etch tool that uses a time-multiplexed SF6-C4F8 process, also known as the Bosch Process. The parameter space for this tool is extensive and getting lost therein easily done. Several pseudo-standard recipes are available as starting points, but most processing on this tool will require some development. We're here to help.

Details

(none given)

Materials Restrictions

Etch target material is limited to silicon with mask material restricted to silicon oxide, silicon nitride, and photoresist. Wafer size is limited to 100mm only. It is not permitted to etch through wafer without a carrier or handle wafer between the etch target and the chuck.


SPTS uEtch Module HF Vapor etcher

Coral ID:WNF--Vapor-Etch--HF
Manufacturer: SPTS
Model:MicroEtch
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/HFVapor-Etch_v1.1e.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

This HF Vapor Dry Etch system is configured with Hydrofluoric and Ethanol vapor used, primarily, for isotropic etching of silicon dioxide without a plasma. The HFVapor system etches at reduced pressure and 45C to isotropically etch sacrificial silicon oxide layers, primarily to release silicon microstructures in MEMS devices. The dry process avoids stiction of released moving parts and damage to delicate structures – common issues with conventional wet processing technology. This is a single wafer system for 4 inch to 8 inch wafers and dies on a carrier wafer.

Details

Etch target is primarily silicon dioxide. Recommended mask materials are silicon, Al, Au, Cr, Ni, SiC, Al2O3, LPCVD nitride. PECVD nitride is NOT recommended as a masking material.

Materials Restrictions

No resist (photo nor ebeam) is allowed in the tool. No Kapton tape is allowed in the tool. Additionally, doped oxide, doped glass, pyrex, Ti, TiO2, and copper are not allowed materials.


Semi-Auto AB-M

Coral ID:WNF--ABM-SemiAuto-Aligner
Manufacturer: ABM
Model:Semi-Auto
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/AB-M Semi-Auto SOP.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Semi-auto contact photolithography exposure tool for 100mm wafers. Capable of front to back alignment utilizing IR.

Details

(none given)

Materials Restrictions

(none)


SiO2 pulsed CVD

Coral ID:WNF--Pulsed-CVD--Altatech
Manufacturer: Altatech
Model:AltaCVD
Lab:WNF
Area:Thin Film Processing
Manual:https://coral.engr.washington.edu/upload/manuals/AltaCVD SOP 20180910.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

CVD of SiO2 using a TEOS precursor with O2 plasma. PECVD and pulsed CVD modes available.

Details

To view information on recipe conditions and film stress, check the shared spreadsheet link in the "More Information" field above. Extracted values of key run variables are accessible through the status tab. Values are processed automatically upon tool disable.

Materials Restrictions

(none)


Solvent Bench

Coral ID:WNF--BATH6-Strip
Manufacturer: WAFAB
Model:72" SST Front Acess
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/BATH6-Strip_2.0.pdf

Description

Solvent bench with an EKC photoresist stripping bath and a sonicator for liftoff processing.

Details

Refilled weekly

Materials Restrictions

(none)


Spin Coater

Coral ID:WNF--SPIN4-General
Manufacturer: Specialty Coating Systems
Model:SCS 6808P
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/SPIN4_2.0.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Flexible, manual bench-top spin coater with vacuum chucks available for pieces from a few mm up to 150 mm wafers.

Details

(none given)

Materials Restrictions

(none)


Spin Coater

Coral ID:WNF--SPIN3-EBeam
Manufacturer: Specialty Coating Systems
Model:SCS-6808P
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/SPIN3-EBeam SCS_Spinner_r5.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Manual, benchtop spin coater with vacuum chucking for samples from a few mm to 150mm wafers.

Details

(none given)

Materials Restrictions

Limited to use for Electron Beam Resists only!


Spin Rinse Dryer

Coral ID:WNF--SRD1-6in
Manufacturer: Class One Technology
Model:Avenger Ultra-Pure
Lab:WNF
Area:Wet Etch and Cleaning
Manual:https://coral.engr.washington.edu/upload/manuals/SRD SOP.pdf

Description

6 inch Wafer Rinse / Dryer

Details

(none given)

Materials Restrictions

(none)


Spin Rinse Dryer

Coral ID:WNF--SRD1-4in
Manufacturer: Class One Technology
Model:Avenger Ultra-Pure
Lab:WNF
Area:Wet Etch and Cleaning
Manual:https://coral.engr.washington.edu/upload/manuals/SRD SOP.pdf

Description

4 inch Wafer Rinse / Dryer

Details

(none given)

Materials Restrictions

(none)


Suss Spin Coater

Coral ID:WNF--SPIN2
Manufacturer: Suss Microtec
Model:LabSpin8
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/SPIN1-2_2.0.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Spin 100-200mm wafers, with a programmable controller, in a class 10 mini-environment, and a dedicated, electro-polished hotplate with automated wafer lift pins.

Details

(none given)

Materials Restrictions

(none)


Suss Spin Coater

Coral ID:WNF--SPIN1
Manufacturer: Suss Microtec
Model:LabSpin8
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/SPIN1-2_2.0.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

Spin 100-200mm wafers, with a programmable controller, in a class 10 mini-environment, and a dedicated, electro-polished hotplate with automated wafer lift pins.

Details

(none given)

Materials Restrictions

(none)


Thinky Mixer

Coral ID:WNF--Thinky-Mixer
Manufacturer: Thinky
Lab:WNF
UW Academic Rate: $10/hr
Industrial Rate: $30/hr
Outside Academic Rate: $10/hr

Description

The Thinky mixer is used to mix and degas PDMS.

Details

(none given)

Materials Restrictions

(none)


Vacuum Wetting Station

Coral ID:WNF-Wetting-Station
Manufacturer: ClassOne
Lab:WNF

Description

vacuum pumped chamber for removal of trapped air and wetting of surfaces prior to electrodeposition

Details

(none given)

Materials Restrictions

(none)


WEST-BOND Wire Bonder

Coral ID:WNF--WestBond
Lab:WNF
Area:Packaging and Back End
Manual:https://coral.engr.washington.edu/upload/manuals/SOP for Wirebonder.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

It is a ball-wedge gold bonder. Has 1 mil (25um) wire diameter. The system is semi-automatic so you can do programmed loops.

Details

(none given)

Materials Restrictions

(none)


Wafer Cleaver

Coral ID:WNF--Cleaver--LatticeGear-AX420
Manufacturer: LatticeGear
Model:AX420
Lab:WNF
Area:Packaging and Back End
Manual:https://coral.engr.washington.edu/upload/manuals/Cleaver - LatticeGear AX420 SOP 20180328.pdf
UW Academic Rate: $30/hr
Industrial Rate: $90/hr
Outside Academic Rate: $30/hr

Description

Precision diamond indentation and break station

Details

(none given)

Materials Restrictions

Recommended for single crystal semiconductor wafers


Wafer Scriber

Coral ID:WNF--Scriber--LatticeGear-FlipScribe
Manufacturer: LatticeGear
Model:FlipScribe
Lab:WNF
UW Academic Rate: $0/hr
Industrial Rate: $0/hr
Outside Academic Rate: $0/hr

Description

Manual scribing fixture for full and partial wafers, specifically designed for scribing the back side of the sample. Scribes across full wafers are possible, which is especially helpful for glass.

Details

4" wafer and small sample holders are available. Others are possible to obtain, please discuss specific needs with staff.

Materials Restrictions

Glass, sapphire, semiconductors. Dry samples only.


Woollam alpha-SE Ellipsometer

Coral ID:WNF--Ellipsometer--Woollam-Alpha-SE
Manufacturer: J.A. Woollam Co.
Model:alpha-SE
Lab:WNF
Area:Thin Film and Materials Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/Woollam alpha-SE Ellipsometer SOP.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

The Woollam alpha-SE spectroscopic ellipsometer can be used to measure thickness and film properties of thin films.

Details

This system utilizes rotating compensator ellipsometry with high-speed CCD detection to collect data from the entire spectrum. The system has a spectral range of 380-890nm.

Materials Restrictions

Samples must be dry and clean before being placed on the sample stage. No samples that will leave a residue are allowed on the sample stage.


Wyko NT3300

Coral ID:WNF--Profilometer--Wyko
Manufacturer: Veeco
Model:Wyko NT3300
Lab:WNF
Area:Device and Structure Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/Wyko.pdf
UW Academic Rate: $50/hr
Industrial Rate: $150/hr
Outside Academic Rate: $50/hr

Description

This instrument takes non-contact 3D surface topography measurements using optical interference. Single nanometer resolution is possible using both phase-shifting interferometry and vertical scanning interferometry. The stage is set up for samples up to 100 mm. The tool is capable of stitching and automated sequences.

Details

(none given)

Materials Restrictions

(none)


Xenon Difluoride vapor etcher

Coral ID:WNF--Vapor-Etch--XeF2
Manufacturer: SPTS
Model:e2
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/XeF2Vapor-Etch_v1b.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr

Description

The XeF2 vapor etch tool is for primarily for isotropic chemical etching of silicon sacrificial layers for the release of MEMS structures.

Details

Xenon difluoride (XeF2) provides a highly selective isotropic etch for Si, Mo and Ge and is an ideal solution for etching sacrificial layers to “release” moving components within MEMS devices. It provides numerous unique advantages and capabilities compared to wet and SF6 plasma etch options. The process is generally carried out at pressures between 0.5 and 4 torr providing controlled, stiction-free and residue-free etching. Typical vertical and lateral silicon etch rates are in the 0.1 - 10 microns/minute range. Because of its selectivity and excellent reach, XeF2 can be used to make very long undercuts with little or no degradation of etch stop, mask or device layers. Silicon dioxide masks, with a Si:oxide selectivity of >1,000:1, have been used to achieve very long undercuts (well over 100μm) and to protect extremely small or thin devices (less than 30nm). XeF2 does not attack polymers or other organic films. Photoresist can be used as a cost-effective mask and polymeric passivation layers, such as those from the Bosch Process, can be used as an effective protective layer for trench sidewalls. XeF2 is also an ideal way to release PDMS, parylene, and SU8. Since XeF2 does not etch packing and dicing materials, it can increase yield by delaying the release of a MEMS device until after dicing or package insertion and wire bonding. XeF2 has been used successfully to release MEMS devices on diced wafers and chips inside packages.

Materials Restrictions

Allowed etch targets: silicon, germanium, molybdenum, SiGe, Ti, W Allowed masks(typical selectivity): photo/ebeam resists, PDMS, silicon dioxide(1000:1), silicon nitride(100:1), Au, Al, Ni, Cr, Pt, SiC See SOP for further information.


YES Downstream Asher

Coral ID:WNF--Etcher--Yes-Asher
Manufacturer: Yield Engineering Systems (YES)
Model:YES CV200 RFS
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/ASH2-YES_UserManual_v3b.pdf
UW Academic Rate: $70/hr
Industrial Rate: $210/hr
Outside Academic Rate: $70/hr

Description

Downstream asher used to remove organics from various materials

Details

A heated, tray-load system, the YES Downstream Asher offers a high degree of process control with 4 available process gasses. The tool has 4 standard recipes for thin film resist stripping, thick film resist stripping, and substrate descum. Users are permitted to work with the tool owner to develop process specific recipes.

Materials Restrictions

No PDMS. System can utilize CF4. The more dangerous nature of this gas requires working with tool owner before you will be allowed to run it.


YES HMDS Oven

Coral ID:WNF--HMDS
Manufacturer: Yeild Enginerring Systems
Model:LP 3 A
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/HMDS Yes Oven.pdf
UW Academic Rate: $30/hr
Industrial Rate: $90/hr
Outside Academic Rate: $30/hr

Description

HMDS oven used for priming wafers prior to resist coating

Details

(none given)

Materials Restrictions

(none)